English  |  正體中文  |  简体中文  |  Items with full text/Total items : 43312/67235
Visitors : 2169356      Online Users : 17
RC Version 5.0 © Powered By DSPACE, MIT. Enhanced by NTU/NCHU Library IR team.

Please use this identifier to cite or link to this item: http://nchuir.lib.nchu.edu.tw/handle/309270000/118862

標題: 3um異方性導電膠材之極精細顯示器構裝
Ultra Fine Flat Panel Display Packaging by 3um Anisotropic Conductive Film
作者: 林義欽
Lin, Yi-Chin
Contributors: 王國禎
Wang Gou-Jen
關鍵字: high resolution;anisotropic conductive film;display;hardness;IC;conductive resistance
日期: 2005
Issue Date: 2012-09-11 11:39:40 (UTC+8)
Publisher: 機械工程學系
摘要: 本研究使用硬度70Hv與40Hv兩種IC金凸塊,分別與目前最細小之3um導電粒子進行高解析度顯示器模組之構裝,探討導通粒子與金凸塊硬度對導通阻抗之影響,以便獲得較佳之製程條件。為能對高解析度顯示器模組之導通阻抗有更完整之分析,本研究亦建立一新的串聯導通模型,並以實驗比較構裝後理論與實際阻抗值的差異。
In this research, dependency of the hardness of the IC gold bump and the properties of the conducting particle on the conducting resistance of the high resolution flat panel display packaging was investigated. Two kinds of IC gold bumps with material hardness 70Hv and 40Hv, respectively, and the currently smallest 3um conducting particle made by Sony Inc. were used to conduct the experiments.
To have deep investigation of the equivalent resistance, a novel resistance model based on the series resistance concept was proposed. Experiments were designed and carried out to distinguish the deviations of the theoretical and the actual impedance.
During the initial loading period of the flat panel display packaging, the IC gold bump acts as both a brace and a breaker for the conducting particle. It is more appropriate for the IC fabrication process that has a ring structure as the wall. In general, a harder gold bump should obtain more effective conducting particles and possesses lower impedance. A gold bump with less hardness becomes more conductive when an external loading is applied.
For the experimental results in this research, it was found that the impedance of the 3um conducting particle used in the flat panel display packaging is 0.5 ohm. The combined impedance of the 3um conducting particle and the IC gold bump with hardness 70Hv after bonding is far less than that of the ITO layout. It can be concluded that the 3um conducting particle and the IC gold bump with hardness 70Hv together can lead to a miniaturized device with less cost.
Appears in Collections:[依資料類型分類] 碩博士論文

Files in This Item:

There are no files associated with this item.






聯絡網站維護人員:wyhuang@nchu.edu.tw,04-22840290 # 412。

DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU/NCHU Library IR team Copyright ©   - Feedback