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National Chung Hsing University Institutional Repository - NCHUIR > 工學院 > 工學院 > 依資料類型分類 > 期刊論文 >  Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process

Please use this identifier to cite or link to this item: http://nchuir.lib.nchu.edu.tw/handle/309270000/128599

標題: Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process
作者: Huang, K.C.;Shieu, F.S.;Hsiao, Y.H.;Liu, C.Y.
關鍵字: Dewetting;retardation;light emitting diode lead frames (LED LFs);SnPb;surface finish;joints;metallurgy;reliability;cu6sn5;ni;sn
日期: 2009
Issue Date: 2012-12-07 14:56:19 (UTC+8)
關連: Journal of Electronic Materials, Volume 38, Issue 11, Page(s) 2270-2274.
摘要: The process of SnPb immersion in Ag/Cu coated light emitting diode lead frames (LED LFs) (alloy 42) was investigated. SnPb solder was found to cause dewetting of the LF substrate after 6 s of immersion. We believed that the dewetting of the SnPb solder could be attributed to spalling of the interfacial compound grains. The addition of a small amount of Ni to the molten SnPb solder (0.1 wt.%) retarded that spalling and helped to prevent dewetting. The mechanisms for spalling retardation by the addition of Ni additives are as follows: (1) the Ni additives slow down the reaction rate between the molten SnPb solder and the Ag/Cu plating layer; (2) the Ni additives participate in interfacial reactions to form (Cu,Ni)(6)Sn(5) ternary compounds, which are more stable than binary compounds and have a slower ripening process.
Relation: Journal of Electronic Materials
Appears in Collections:[依資料類型分類] 期刊論文
[依教師分類] 薛富盛

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