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National Chung Hsing University Institutional Repository - NCHUIR > 工學院 > 光電工程研究所 > 依資料類型分類 > 期刊論文 >  Adhesion investigation of low-k films system using 4-point bending test

Please use this identifier to cite or link to this item: http://nchuir.lib.nchu.edu.tw/handle/309270000/131693

標題: Adhesion investigation of low-k films system using 4-point bending test
作者: Lee, C.C.;Huang, J.;Chang, S.T.;Wang, W.C.
關鍵字: 4-point bending;Interfacial crack;FEA;Adhesion;Thin film;dissimilar elastic-materials;bimaterial interface;crack penetration;deflection
日期: 2009
Issue Date: 2012-12-07 16:30:50 (UTC+8)
關連: Thin Solid Films, Volume 517, Issue 17, Page(s) 4875-4878.
摘要: This research presents a simulation-based methodology to accurately predict interfacial adhesion behaviors of heterostructures. Validation of the proposed approach is achieved through comparison of 4-point bending test results on interfaces of multiple stacked low-k films with those of theoretical solutions from the finite element analysis. Impact induced by the compliance of 4-point bending test system can be neglected using the averaged energy release rate of various crack lengths in simulations. On the basis of precise predictions drawn from the considered analyses, uncertainty of experimental tests for the nano-scale fractured strength could be promptly observed and estimated. (C) 2009 Elsevier B.V. All rights reserved.
Relation: Thin Solid Films
Appears in Collections:[依教師分類] 張書通
[依資料類型分類] 期刊論文
[依教師分類] 張書通

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