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National Chung Hsing University Institutional Repository - NCHUIR > 工學院 > 精密工程研究所 > 依資料類型分類 > 期刊論文 >  Cup-shaped copper heat spreader in multi-chip high-power LEDs application

Please use this identifier to cite or link to this item: http://nchuir.lib.nchu.edu.tw/handle/309270000/145474

標題: Cup-shaped copper heat spreader in multi-chip high-power LEDs application
作者: Horng, Ray Hua;Hu, Hung Lieh;Lin, Re Ching;Tang, Li Shen;Hsu, Chen Peng;Ou, Sin Liang
Contributors: Wei-Chun Wang
日期: 2012-06
Issue Date: 2013-07-02 10:07:34 (UTC+8)
摘要: In this study, cup-shaped copper sheets were developed to
improve heat dispassion for high-power light emitting diodes (LEDs) array
module (3 � 3, 4 � 4, and 5 � 5) using an electroplating technique. The cupshaped
copper sheets were directly contacted with sapphire to enhance the
heat dissipation of the chip itself. The lateral emitting light extraction and
heat dissipation of high-power LEDs were enhanced and efficient. The
surface temperature was not only decreasing but also uniform for each LED
chip with the cup-shaped copper heat spreader adoption. The high thermal
transmitting performance of cup-shaped copper heat spreader allows
thermal resistance reducing 0.7, 0.6, and 0.7 K/W of 3 � 3, 4 � 4, and 5 � 5
LED array module, respectively. In addition, the light output power was
increased of 14, 13, and 12% with 3 � 3, 4 � 4, and 5 � 5 LEDs array
module using cup-shaped copper sheet at high current injection. High heat
dissipation performance and light extraction were obtained by cup-shaped
copper sheet with copper bulk and silver mirror.
Relation: Optics Express, Volume 20, Issue S5, page(s) A597-A605.
Appears in Collections:[依資料類型分類] 期刊論文
[依教師分類] 洪瑞華
[依教師分類] 洪瑞華

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