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標題: 高鉍合金與不同金屬基材之界面反應
Interfacial Reactions Between High-Bi Alloys and Various Metallic Substrates
作者: 王錦翊
Wang, Jin-Yi
Contributors: 陳志銘
Chih-Ming Chen
化學工程學系所
關鍵字: 無鉛銲料;電子封裝
Lead-free solder;electron packaging
日期: 2012
Issue Date: 2013-11-21 10:13:17 (UTC+8)
Publisher: 化學工程學系所
摘要: 本研究使用Bi-xSn(x=2,5,10wt.%Sn)合金與銅、鎳基材進行界面
反應與機械性質研究。高鉍合金/銅基材於迴焊反應中,只有Cu3Sn
生成,並發現Cu3Sn 與銅基材產生脫離的現象,富鉍相(Bi-rich)存在
於Cu3Sn 與銅基材間,對此現象我們使用三元相圖解釋,並提出了合
理的機制。而在高鉍合金/銅基材之熱處理反應,在界面處生成的
Cu3Sn 會隨著熱處理時間增加而增厚,並且部分的Cu3Sn 會轉變成
Cu6Sn5。Bi-2wt.%Sn/銀/銅系統中,迴焊反應在15 秒時,Cu3Sn 已經
與基材脫離, 且銀鍍層溶入合金與介金屬化合物(intermetallic
compound, IMC)中,發現界面微結構與高鉍合金/銅基材相似,這顯
示導入銀鍍層並未對界面微結構產生影響。
Bi-2wt.%Sn/鎳基材於迴焊反應生成Ni3Sn2,並隨著反應時間的增
加而粗化,而Bi-5wt.%Sn 與Bi-10wt.%Sn 則生成層狀的Ni3Sn4。在
高鉍合金與鎳基材熱處理反應,生成的IMC 為Ni3Sn4,並隨著熱處
理的時間增加而增厚。而Bi-2wt%Sn/金/鎳系統之迴焊反應與固態熱
處理反應,由結果顯示,金鍍層在迴焊時已溶入合金中,與純鎳基材
比較,導入金鍍層並未對界面微結構產生改變,在熱處理反應生成的
IMC 主要為Ni3Sn4 並且微溶2.9at.%金,迴焊反應IMC 主要為Ni3Sn2微溶4.2at%金。
由剪切力測試數據顯示,高鉍合金/銅基材與鎳基材的銲點強度
皆優於Pb-5wt.%Sn/銅與鎳基材,表示高鉍合金具有高潛力取代高鉛
銲料。
In this study, the Bi-xSn(x=2,5,10wt.%Sn) alloys joined with the Cu and Ni substrates are used to investigate the interfacial reactions and shear strength of the high-Bi/Cu and high-Bi/Ni solder joint systems. For the high-Bi/Cu joints, there is only Cu3Sn formed at the interface. The Cu3Sn phase detached from the Cu substrate, and a Bi-rich layer existed between the Cu substrate and the Cu3Sn phase. We propose a possible mechanism to explain the detachment phenomenon of the Cu3Sn phase based on the ternary Sn-Bi-Cu isothermal section. For the high-Bi/Cu joints under solid-state aging, the Cu3Sn phase grew with increasing the aging time. At the same time, part of the Cu3Sn phase was transformed into the Cu6Sn5 phase. In the Bi-2wt.%Sn/Ag/Cu system, the Cu3Sn phase also detached from the Cu substrate after reflow for 15 sec. The Ag layer disappeared at the interface and dissolved into the high-Bi alloy and the intermetallic compound (IMC). The interfacial reaction of the Bi-2wt.%Sn/Ag/Cu is similar to the high-Bi/Cu aging reaction. Therefore, it is concluded that the addition of an Ag layer has no significant influence on the interfacial reactions of the high-Bi/Cu joints.
In the Bi-2wt.%Sn/Ni system, the product of the reflow reaction is the Ni3Sn2 phase, and this phase grew with increasing the reflow time. In the Bi-5wt.%Sn and Bi-10wt.%Sn/Ni systems, the product of the reflow reaction is the Ni3Sn4 phase, and the IMC became thicker as the reflow time increased. For the solid-state aging, the Ni3Sn4 phase grew with increasing the aging time. In the Bi-2wt.%Sn/Au/Ni system, the Au layer dissolved into the molten alloy and the IMC during the reflow reaction and aging reaction. Compared with the Bi-2wt.%Sn/Au/Ni and high-Bi alloy/Ni interfacial reactions, the interfacial morphologies are similar for these two systems.
According to the data of interfacial shear strength, the strength of the high-Bi alloy/Cu and Ni substrates are better than the Pb-5wt.%Sn/Cu and Ni substrates, so the high-Bi alloys have high potential to replace the high-lead solder
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